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Marking Welding&Cutting Trimming
Marking By Category
Marking on semiconductor wafer using LASER is non-contacting dry process and this method has many advantages such as microfabrication, delicate, indelible, clean and flexible. LASER MARKING contributes stable traceability and high-efficiency for automation of production process.
It is applicable not only Si and GaAs wafer, but also compound wafer such as SiC and GaN by model SL473DT5/FT5 equipped UV laser.

System Line-up:
・Basic model for Low-volume processing (DS5/DT5) ,
・High Throughput model for high-volume processing (FS5/FT5)
・12inch model (GS5)
SL473 Series

Application: Wafer marking
(Si, GaAs, GaN, SiC, etc.)
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