LASER FINE PROCESSING MACHINE
Realizing high-quality processing with less heat effects
Laser Fine Processing Machine SL527A / B Series
Providing general-purpose processing solutions for high-mix low-volume production and prototype production.
FEATURE
Various choice of light sources and optical systems
Possible to select laser beam source and optical unit upon allocation, target material & etc.
| SL527 Series | Pulse Width | ||
|---|---|---|---|
| Picosecond | Nanosecond | ||
| Wavelength | 532 nm | ○ | ○ |
| 355 nm | ○ | ○ | |
Realizing excellent operability
Excellent operability due to its extensive functions such as processing data editing, processing quality adjustment settings, and observation functions. Layer processing is available by parameter setting with excellent operability by GUI (T-LASE * in-house developed) Layer processing by Z-axis operation.
Individual support is also available.
Possible to consultation for auxiliary peripheral function and customized optical units. Realizing simultaneous multi-point processing by using a diffractive optical element (DOE) with laser beam is split into multiple parts.
APPLICATION
Cu sheet lattice cutting
Aluminum sheet lattice cutting
Battery cu tab cutting (Image)
Battery aluminum tab cutting (Image)
Polyimide cutting
Epoxy resin cutting
Processing of suction rubber pads
MAIN SPECIFICATION
| Model | SL527AS | SL527AT | SL527BS | SL527BT |
|---|---|---|---|---|
| Laser type | Picosecond | Picosecond | Nanosecond | Nanosecond |
| Wavelength | 532 nm | 355 nm | 532 nm | 355 nm |
| Pulse Width | ＜15 ps | ＜25 ns | ||
VIDEO
SUS lattice processing
Polyimide cutting and drilling
About Automation
Please feel free to contact us if you need this laser unit for your experimental development or also automated equipment including transportation/supplying process of substrates.
